Integrally formed single piece light emitting diode light wire

ABSTRACT

A flexible, integrally formed single piece light emitting diode (LED) light wire that provides a smooth, uniform lighting effect from all directions of the LED light wire. The integrally formed single piece LED light wire contains a conductive base comprising first and second bus elements formed from a conductive material. The bus elements distribute power from a power source to LEDs that are mounted on the first and second bus elements so that it draws power from and adds mechanical stability to the first and second bus elements. The flexible, integrally formed single piece LED light wire is assembled so that the first and second bus elements are connected to each other prior to the LED being mounted and such integrally formed single piece LED light wire is formed without a substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This utility application is a continuation of U.S. Ser. No. 11/854,145,filed Sep. 12, 2007, which claims benefit, under 35 U.S.C. §119(e), ofU.S. Provisional Patent Application Ser. No. 60/844,184, filed Sep. 12,2006, the entirety of which is incorporated herein by reference.

Throughout this application, several publications are referenced.Disclosure of these references in their entirety is hereby incorporatedby reference into this application.

The present invention relates to light wires and, more specifically, anintegrally formed single piece of light wire containing light emittingdiodes (“LEDs”), and systems and processes for manufacturing such alight wire, wherein the LEDs and associated circuitry are protected frommechanical damage and environmental hazards, such as water and dust.

BACKGROUND THE INVENTION

Conventional incandescent or LED light wires are commonly used in avariety of indoor and outdoor decorative or ornamental lightingapplications. For example, such conventional light wires are used tocreate festive holiday signs, outline architectural structures such asbuildings or harbors, and provide under-car lighting systems. Theselight wires are also used as emergency lighting aids to increasevisibility and communication at night or when conditions, such as poweroutages, water immersion and smoke caused by fires and chemical fog,render normal ambient lighting insufficient for visibility.

Conventional LED light wires consume less power, exhibit a longerlifespan, are relatively inexpensive to manufacture, and are easier toinstall when compared to light tubes using incandescent light bulbs.More increasingly, LED light wires are used as viable replacements forneon light tubing.

As illustrated in FIG. 1, conventional light wire 100 consists of aplurality of illuminant devices 102, such as incandescent light bulbs orLEDs, connected together by a flexible wire 101 and encapsulated in aprotective tube 103. A power source 105 creates an electrical currentthat flows through the flexible wire 101 causing the illuminant devices102 to illuminate and create an effect of an illuminated wire. Theilluminant devices 102 are connected in series, parallel, or incombination thereof. Also, the illuminant devices 102 are connected withcontrol electronics in such a way that individual illuminant devices 102may be selectively switched on or off to create a combination of lightpatterns, such as strobe, flash, chase, or pulse.

In conventional light wires, the protective tube 103 is traditionally ahollow, transparent or semi-transparent tube which houses the internalcircuitry (e.g., illuminant devices 102; flexible wire 101). Since thereis an air gap between the protective tube 103 and internal circuitry,the protective tube 103 provides little protection for the light wireagainst mechanical damage due to excessive loads, such as the weight ofmachinery that is directly applied to the light wire. Furthermore, theprotective tube 103 does not sufficiently protect the internal circuitryfrom environmental hazards, such as water and dust. As a result, theseconventional light wires 100 with protective tube 103 are foundunsuitable for outdoor use, especially when the light wires are exposedto extreme weather and/or mechanical abuse.

In conventional light wires, wires, such as flexible wire 101, are usedto connect the illuminant devices 102 together. In terms ofmanufacturing, these light wires are traditionally pre-assembled usingsoldering or crimp methods and then encapsulated via a conventionalsheet or hard lamination process in protective tube 103. Such processesof manufacturing are labor intensive and unreliable. Furthermore, suchprocesses decrease the flexibility of the light wire.

In response to the above-mentioned limitations associated with theabove-mentioned conventional light wires and the manufacture thereof,LED light strips have been developed with increased complexity andprotection. These LED light strips consist of circuitry including aplurality of LEDs mounted on a support substrate containing a printedcircuit and connected to separate electrical conductors (e.g., twoseparate conductive bus elements). The LED circuitry and the electricalconductors are encapsulated in a protective encapsulant without internalvoids (which includes gas bubbles) or impurities, and are connected to apower source. These LED light strips are manufactured by an automatedsystem that includes a complex LED circuit assembly process and a softlamination process. Examples of these LED light strips and themanufacture thereof are discussed in U.S. Pat. Nos. 5,848,837, 5,927,845and 6,673,292, all entitled “Integrally Formed Linear Light Strip WithLight Emitting Diode”; U.S. Pat. No. 6,113,248, entitled “AutomatedSystem For Manufacturing An LED Light Strip Having An Integrally FormedConnected”; and U.S. Pat. No. 6,673,277, entitled “Method ofManufacturing a Light Guide”.

Although these LED light strips are better protected from mechanicaldamage and environmental hazards, these LED light strips requireadditional separate parts, such as a support substrate and two separateconductive bus elements, to construct its internal LED circuitry. Also,to manufacture these LED light strips, additional manufacturing steps,such as purification steps, and equipment are required to assemble thecomplex LED circuit and painstakingly remove internal voids andimpurities in the protective encapsulant. Such additional procedures,parts and equipment increase manufacturing time and costs.

Additionally, just like the conventional light wires discussed above,these LED light strips only provide one-way light direction. Moreover,the complexity of the LED circuitry and lamination process makes the LEDlight strip too rigid to bend.

SUMMARY OF THE INVENTION

In light of the above, there exists a need to further improve the art.Specifically, there is a need for an improved integrally formed singlepiece LED light wire that is flexible and provides a smooth, uniformlighting effect from all directions of the integrally formed singlepiece LED light wire. There is also a need to reduce the number ofseparate parts required to produce the integrally formed single pieceLED light wire. Furthermore, there is also a need for an LED light wirethat requires less procedures, parts, and equipment and can therefore bemanufactured by a low cost automated process.

An integrally formed single piece LED light wire, comprises a conductivebase comprising first and second bus elements formed from a conductivematerial adapted to distribute power from a power source. At least onelight emitting diode (LED) having first and second electrical contactsis mounted on the first and second bus elements so that it draws powerfrom and adds mechanical stability to the first and second bus elements.The first and second bus elements are connected to each other prior tothe LED being mounted. The integrally formed single piece LED light wireis formed without a substrate.

According to an embodiment of the integrally formed single piece LEDlight wire, an encapsulant completely encapsulating the first and secondbus elements, and the at least one LED.

According to an embodiment of the integrally formed single piece LEDlight wire, the encapsulant is textured.

According to an embodiment of the integrally formed single piece LEDlight wire, the encapsulant includes light scattering particles.

According to an embodiment of the integrally formed single piece LEDlight wire, a plurality of LEDs, are connected in series.

According to an embodiment of the integrally formed single piece LEDlight wire, a plurality of LEDs are connected in series and parallel.

According to an embodiment of the integrally formed single piece LEDlight wire, the first and second bus elements are separated after atleast one LED is mounted.

According to an embodiment of the integrally formed single piece LEDlight wire, a connection between the LED and one of the first and secondbus elements is made using solder, welding, or conductive epoxy.

According to an embodiment of the integrally formed single piece LEDlight wire, a connection between the LED and either the first or secondbus elements is made using solder, welding, wire bonding, and conductiveepoxy.

According to an embodiment of the integrally formed single piece LEDlight wire, includes a third bus element formed from a conductivematerial adapted to distribute power from the power source a pluralityof LEDs, a first set LEDs are connected in series and parallel betweenthe first and second bus elements and a second set LEDs are connected inseries and parallel between the second and third bus elements.

According to an embodiment of the integrally formed single piece LEDlight wire, an anode of a first LED is connected to the first buselement and a cathode of the first LED is connected to the second buselement, an anode of a second LED is connected to the second bus elementand a cathode of the second LED is connected to the third bus element,and a cathode of a third LED is connected to the first bus element andan anode of the first LED is connected to the second bus element.

According to an embodiment of the integrally formed single piece LEDlight wire, a cathode of a fourth LED is connected to the second buselement and an anode of the fourth LED is connected to the third buselement.

According to an embodiment of the integrally formed single piece LEDlight wire, the LEDs are selected from red, blue, green, and white LEDs.

According to an embodiment of the integrally formed single piece LEDlight wire includes a controller adapted to vary the power provided tothe first, second, and third bus elements.

According to an embodiment of the integrally formed single piece LEDlight wire includes a core about which the conductive base is wound in aspiral manner.

According to an embodiment an integrally formed single piece LED lightwire includes a first bus element formed from a conductive materialadapted to distribute power from a power source, a second bus elementformed from a conductive material adapted to distribute power from thepower source, a third bus element formed from a conductive materialadapted to distribute a control signal, at least one light emittingdiode (LED) module, said LED module comprising a microcontroller and atleast one LED, the LED module having first, second, and third electricalcontacts, the LED module being mounted on the first, second, and thirdbus elements so that it draws power from the first and second buselements and receives a control signal form the third bus element,wherein the integrally formed single piece LED light wire is formedwithout a substrate.

According to an embodiment of the integrally formed single piece LEDlight wire, the LED module has a plurality of LEDs selected from thegroup consisting of red, blue, green, and white LEDs.

According to an embodiment of the integrally formed single piece LEDlight wire, the LED module includes a fourth contact for outputting thereceived control signal.

According to an embodiment of the integrally formed single piece LEDlight wire includes an encapsulant completely encapsulating said first,second, and third bus elements, and said at least one LED module.

According to an embodiment of the integrally formed single piece LEDlight wire, each LED module has a unique address.

According to an embodiment of the integrally formed single piece LEDlight wire, the LED module has a static address.

According to an embodiment of the integrally formed single piece LEDlight wire, the LED module address is dynamic.

An integrally formed single piece LED light wire, comprising: first andsecond bus elements formed from a conductive material adapted todistribute power from a power source; at least two conductor segmentsarranged between the first and second bus elements; and at least onelight emitting diode (LED), said LED having first and second electricalcontacts, the first electrical contact being connected to a firstconductor segment and the second electrical contact being connected to asecond conductor segment; wherein the first and second conductorsegments are coupled to the first and second bus elements to power theLED.

According to an embodiment of the integrally formed single piece LEDlight wire, includes a flexible substrate, the first and secondconductor segments and the first and second bus elements, beingsupported by the flexible substrate.

According to an embodiment of the integrally formed single piece LEDlight wire, wherein flexible substrate is wound about a core.

DESCRIPTION OF THE FIGURES

FIG. 1 is a representation of a conventional light wire;

FIG. 2 is a perspective view illustrating an integrally formed singlepiece LED light wire according to an embodiment of the presentinvention;

FIG. 3 is a cross-sectional view of an embodiment of the integrallyformed single piece LED light wire according to the present invention;

FIG. 4A is a side view of an integrally formed single piece LED lightwire according to another embodiment of the present invention;

FIG. 4B is a top view of an integrally formed single piece LED lightwire according to another embodiment of the present invention;

FIG. 5 is a cross-sectional view of the integrally formed single pieceLED light wire shown in FIGS. 4A & 4B;

FIG. 6A is an embodiment of the conductive base;

FIG. 6B is a schematic diagram of the conductive base of FIG. 6A;

FIG. 7A is an embodiment of the conductive base;

FIG. 7B is a schematic diagram of the conductive base of FIG. 7A;

FIG. 8A is an embodiment of the conductive base;

FIG. 8B is a schematic diagram of the conductive base of FIG. 8A;

FIG. 9A is an embodiment of the conductive base;

FIG. 9B is a schematic diagram of the conductive base of FIG. 9A;

FIG. 10A is an embodiment of the conductive base;

FIG. 10B is a schematic diagram of the conductive base of FIG. 10A;

FIG. 11A is an embodiment of the conductive base;

FIG. 11B is a schematic diagram of the conductive base of FIG. 11A;

FIG. 11C depicts a conductive base wrapped on a core prior toencapsulation;

FIG. 12A depicts an embodiment of an LED mounting area of a conductivebase;

FIG. 12B depicts a mounted LED on a conductive base;

FIG. 13 depicts LED chip bonding in an LED mounting area;

FIG. 14 depicts the optical properties of an embodiment of theinvention;

FIGS. 15A-C depict a cross-sectional view of three different surfacetextures of the encapsulant;

FIG. 16A is a schematic diagram of an integrally formed single piece LEDlight wire;

FIG. 16B depicts an embodiment of an integrally formed single piece LEDlight wire;

FIG. 17 is a schematic diagram of a full color integrally formed singlepiece LED light wire;

FIG. 18 is a schematic diagram of a control circuit for a full colorintegrally formed single piece LED light wire;

FIG. 19 is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 20A is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 20B is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 21 depicts an LED module;

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an integrally formed single piece LEDlight wire containing a plurality of LEDs that are connected toconductors forming a mounting base or conductors supported on insulatingmaterial to provide a combined mounting base. Both types of mountingbase provides an (1) electrical connection, (2) a physical mountingplatform or a mechanical support for the LEDs, and (3) a light reflectorfor the LEDs. The mounting base and LEDs are encapsulated in atransparent or semi-transparent encapsulant which may contain lightscattering particles.

In one embodiment of the present invention, as shown in FIGS. 2 and 3,an integral single piece LED light wire, which includes a sub-assembly310 comprising at least one LED 202 connected to a conductive base 201,wherein the sub-assembly 310 is encapsulated within an encapsulant 303.As shown in FIG. 2, the LEDs 202 are connected in series. Thisembodiment offers the advantage of compactness in size, and allows theproduction of a long, thin LED light wire with an outer diameter of 3 mmor less. The conductive base 301 is operatively connected to a powersource 305 to conduct electricity.

In another embodiment, as illustrated in FIGS. 4A, 4B, and 5, thepresent invention may be an integrally formed single piece LED lightwire comprising a plurality of sub-assemblies 510. Each sub-assembly 510consists of at least one LED 202 connected to a conductive base 401. Thesub-assemblies 510 are encapsulated within an encapsulant 503. As shown,the LEDs 202 are connected in parallel. The conductive base 401 isoperatively connected to a power source 405 to activate LEDs 202.

AC or DC power from power source 405 may be used to power the integrallyformed single piece LED light wire. Additionally, a current source maybe used. Brightness may be controlled by digital or analog controllers.

The conductive base 201, 401 extends longitudinally along the length ofthe integrally formed single piece LED light wire, and act as an (1)electrical conductor, (2) a physical mounting platform or a mechanicalsupport for the LEDs 202, and (3) a light reflector for the LEDs 202.

The conductive base 201, 401 may be, for example, punched, stamped,printed, silk-screen printed, or laser cut, or the like, from a metalplate or foil to provide the basis of an electrical circuit, and may bein the form of a thin film or flat strip. In another embodiment, theconductive base 201, 401, is formed using stranded wire. Additionalcircuitry, such as active or passive control circuit components (e.g., amicroprocessor, a resistor, a capacitor), may be added and encapsulatedwithin an encapsulant to add functionality to the integrally formedsingle piece LED light wire. Such functionality may include, but notlimited to, current limiting (e.g., resistor), protection, flashingcapability, or brightness control. For example, a microcontroller may beincluded to make the LEDs 202 individually addressable; thereby,enabling the end user to control the illumination of selective LEDs 202in the LED light wire to form a variety of light patterns, e.g., strobe,flash, chase, or pulse. In one embodiment, external control circuitry isconnected to the conductive base 201, 401.

The conductive base 201, 401 may be flexible or rigid, and is made of,but not limited to, thin film PCB material, conductive rod, copperplate, copper clad steel plate, copper clad alloy, or a base materialcoated with a conductive material.

First Embodiment of the Conductive Base

In a first embodiment of the conductive base assembly 600, shown in FIG.6A, the base material of the conductive base 601 is preferably a longthin narrow metal strip or foil. In one embodiment, the base material iscopper. A hole pattern 602, shown as the shaded region of FIG. 6A,depict areas where material from the conductive base 601 has beenremoved. In one embodiment, the material has been removed by a punchingmachine. The remaining material of the conductive base 601 forms thecircuit of the present invention. Alternatively, the circuit may beprinted on the conductive base 601 and then an etching process is usedto remove the areas 602. The pilot holes 605 on the conductive base 600act as a guide for manufacture and assembly.

The LEDs 202 are mounted either by surface mounting or LED chip bondingand soldered, welded, riveted or otherwise electrically connected to theconductive base 601 as shown in FIG. 6A. The mounting and soldering ofthe LEDs 202 onto the conductive base 601 not only puts the LEDs 202into the circuit, but also uses the LEDs 202 to mechanically hold thedifferent unpunched parts of the conductive base 601 together. In thisembodiment of the conductive base 601 all of the LEDs 202 areshort-circuited, as shown in FIG. 6B. Thus, additional portions ofconductive base 601 are removed as discussed below so that the LEDs 202are not short-circuited. In one embodiment, the material from theconductive base 601 is removed after the LEDs 202 are mounted.

Second Embodiment of the Conductive Base

To create series and/or parallel circuitries, additional material isremoved from the conductive base. As shown in FIG. 7A, the conductivebase 701 has an alternative hole pattern 702 relative to the holepattern 602 depicted in FIG. 6A. With the alternative hole pattern 702,the LEDs 202 are connected in series on the conductive base 701. Theseries connection is shown in FIG. 7B, which is a schematic diagram ofthe conductive base assembly 700 shown in FIG. 7A. As shown, themounting portions of LEDs 202 provide support for the conductive base701.

Third Embodiment of the Conductive Base

In a third embodiment of the conductive base, as shown in FIG. 8A, aconductive base assembly 800 is depicted having a pattern 802 is punchedout or etched into the conductive base 801. Pattern 802 reduces thenumber of punched-out gaps required and increase the spacing betweensuch gaps. Pilot holes 805 act as a guide for the manufacturing andassembly process. As shown in FIG. 8B, the LEDs 202 are short-circuitedwithout the removal of additional material. In one embodiment, thematerial from conductive base 801 is removed after the LEDs 202 aremounted.

Fourth Embodiment of the Conductive Base

As illustrated in FIG. 9A, a fourth embodiment of the conductive baseassembly 900 contains an alternative hole pattern 902 that, in oneembodiment, is absent of any pilot holes. Compared to the thirdembodiment, more gaps are punched out in order to create two conductingportions in the conductive base 901. Thus, as shown in FIG. 9B, thisembodiment has a working circuit where the LEDs 202 connected in series.

Fifth and Sixth Embodiments of the Conductive Base

FIG. 10A illustrates a fifth embodiment of conductive base assembly 1000of the conductive base 1001. Shown is a thin LED light wire with atypical outer diameter of 3 mm or less. As shown in FIG. 10A, (1) theLEDs 202 connected on the conductive base 1001 are placed apart,preferably at a predetermined distance. In a typical application, theLEDs 202 are spaced from 3 cm to 1 m, depending upon, among otherthings, at least the power of the LEDs used and whether such LEDs aretop or side-emitting. The conductive base 1001 is shown absent of anypilot holes. The punched-out gaps that create a first hole pattern 1014that are straightened into long thin rectangular shapes. LEDs 202 aremounted over punched-out gaps 1030. However, as shown in FIG. 10B, theresultant circuit for this embodiment is not useful since all the LEDs202 are short-circuited. In subsequent procedures, additional materialis removed from conductive base 1001 so that LEDs 202 are in series orparallel as desired.

In the sixth embodiment of the conductive base assembly 1100, conductivebase 1101, as shown in FIG. 11A, contains a hole pattern 1118 whichcreates a working circuit in the conductive base 1101 with a seriesconnections of LEDs 202 mounted onto the conductive base 1101. Thisembodiment is useful in creating a thin LED light wire with a typicaloutside diameter of 3 mm or less.

LEDs

The LEDs 202 may be, but are not limited to, individually-packaged LEDs,chip-on-board (“COB”) LEDs, or LED dies individually die-bonded to theconductive base 301. The LEDs 202 may also be top-emitting LEDs,side-emitting LEDs, side view LEDs, or a combination thereof. In apreferred embodiment, LEDs 202 are side-emitting LEDs and/or side viewLEDs.

The LEDs 202 are not limited to single colored LEDs. Multiple-coloredLEDs may also be used. For example, if Red/Blue/Green LEDs (RGB LEDs)are used to create a pixel, combined with a variable luminance control,the colors at each pixel can combine to form a range of colors.

Mounting of LEDs onto the Conductive Base

As indicated above, LEDs 202 are mounted onto the conductive base by oneof two methods, either surface mounting or LED chip bonding.

In surface mounting, as shown in FIG. 12, the conductive base 1201 isfirst punched to assume any one of the embodiments discussed above, andthen stamped to create an LED mounting area 1210. The LED mounting area1210 shown is exemplary, and other variations of the LED mounting area1210 are possible. For example, the LED mounting area 1201 may bestamped into any shape which can hold an LED 202.

Alternatively, the LED mounting area 1220 may not be stamped, as shownin FIG. 12B. A soldering material 1210 (e.g., liquid solder; soldercream; solder paste; and any other soldering material known in the art)or conductive epoxy is placed either manually or by a programmableassembly system in the LED mounting area 1220, as illustrated in FIG.12A. LEDs 202 are then placed either manually or by a programmable pickand place station on top of the soldering material 1210 or a suitableconductive epoxy. The conductive base 1201 with a plurality of LEDs 202individually mounted on top of the soldering material 1210 will directlygo into a programmable reflow chamber where the soldering material 1210is melted or a curing oven where the conductive epoxy is cured. As aresult, the LEDs 202 are bonded to the conductive base 1201 as shown inFIG. 12B.

As illustrated in FIG. 13, LEDs 202 may be mounted onto the conductivebase 1301 by LED chip bonding. The conductive base 1301 is stamped tocreate a LED mounting area 1330. The LED mounting area 1330 shown inFIG. 13 is exemplary, and other variations of the LED mounting area1330, including stamped shapes, like the one shown in FIG. 12A, whichcan hold an LED, are envisioned. LEDs 202, preferably an LED chip, areplaced either manually or by a programmable LED pick place machine ontothe LED mounting area 1330. The LEDs 202 are then wire bonded onto theconductive base 1301 using a wire 1340. It should be noted that wirebonding includes ball bonding, wedge bonding, and the like.Alternatively, LEDs 202 may be mounted onto the conductive base 301using a conductive glue or a clamp.

It should be noted that the conductive base in the above embodiments canbe twisted in an “S” shape. Then, the twisting is reversed in theopposite direction for another predetermined number of rotations;thereby, making the conductive base form a shape of a “Z”. This “S-Z”twisted conductive base is then covered by an encapsulant. With its“S-Z” twisted placement, this embodiment will have increasedflexibility, as well as emit light uniformly over 360°.

In another embodiment, as shown in FIG. 11C, conductive base (e.g.,conductive base 1101) delivering electrical current to the LEDs is woundinto spirals. The spiraling process can be carried out by a conventionalspiraling machine, where the conductive base is placed on a rotatingtable and a core 9000 passes through a hole in the center of the table.The pitch of the LED is determined by the ratio of the rotation speedand linear speed of the spiraled assembly. The core 9000 may be in anythree-dimensional shape, such as a cylinder, a rectangular prism, acube, a cone, a triangular prism, and may be made of, but not limitedto, polymeric materials such as polyvinyl chloride (PVC), polystyrene,ethylene vinyl acetate (EVA), polymethylmethacrylate (PMMA) or othersimilar materials or, in one embodiment, elastomer materials such assilicon rubber. The core 9000 may also be solid. In one embodiment, theconductive base delivering electrical current to the LEDs is wound intospirals on a solid plastic core and then encapsulated in a transparentelastomer encapsulant.

Encapsulant

The encapsulant provides protection against environmental elements, suchas water and dust, and damage due to loads placed on the integral LEDlight wire. The encapsulant may be flexible or rigid, and transparent,semi-transparent, opaque, and/or colored. The encapsulant may be madeof, but not limited to, polymeric materials such as polyvinyl chloride(PVC), polystyrene, ethylene vinyl acetate (EVA), polymethylmethacrylate(PMMA) or other similar materials or, in one embodiment, elastomermaterials such as silicon rubber.

Fabrication techniques concerning the encapsulant include, withoutlimitation, extrusion, casting, molding, laminating, or a combinationthereof. The preferred fabrication technique for the present inventionis extrusion.

In addition to its protective properties, the encapsulant assists in thescattering and guiding of light in the LED light wire. As illustrated inFIG. 14, that part of the light from the LEDs 202 which satisfies thetotal internal reflection condition will be reflected on the surface ofthe encapsulant 1403 and transmitted longitudinally along theencapsulant 1403. Light scattering particles 1404 may be included in theencapsulant 1403 to redirect such parts of the light as shown by lightpath 1406. The light scattering particles 1404 are of a size chosen forthe wavelength of the light emitted from the LEDs. In a typicalapplication, the light scattering particles 1404 have a diameter in thescale of nanometers and they can be added to the polymer either beforeor during the extrusion process.

The light scattering particles 1404 may also be a chemical by-productassociated with the preparation of the encapsulant 1403. Any materialthat has a particle size (e.g., a diameter in the scale of nanometers)which permits light to scatter in a forward direction can be a lightscattering particle.

The concentration of the light scattering particles 1404 is varied byadding or removing the particles. For example, the light scatteringparticles 1404 may be in the form of a dopant added to the startingmaterial(s) before or during the extrusion process. The concentration ofthe light scattering material 1404 within the encapsulant 1403 isinfluenced by the distance between LEDs, the brightness of the LEDs, andthe uniformity of the light. A higher concentration of light scatteringmaterial 1404 may increase the distance between neighboring LEDs 202within the LED light wire. The brightness of the LED light wire may beincreased by employing a high concentration of light scattering material1404 together within closer spacing of the LEDs 202 and/or usingbrighter LEDs 202. The smoothness and uniformity of the light within theLED light wire can be improved by increasing the concentration of lightscattering material 1404 may increase such smoothness and uniformity.

As shown in FIGS. 3 and 5 the sub-assemblies 310 and 510 aresubstantially at the center of the encapsulant. The sub-assemblies 310and 510 are not limited to this location within the encapsulant. Thesub-assemblies 310 and 510 may be located anywhere within theencapsulant. Additionally, the cross-sectional profile of theencapsulant is not restricted to circular or oval shapes, and may be anyshape (e.g., square, rectangular, trapezoidal, star). Also, thecross-sectional profile of the encapsulant may be optimized to providelensing for light emitted by the LEDs 202. For example, another thinlayer of encapsulant may be added outside the original encapsulant tofurther control the uniformity of the emitted light from the presentinvention.

Surface Texturing and Lensing

The surface of the integral LED light wire can be textured and/or lensedfor optical effects. The integral single piece LED light wire may becoated (e.g., with a fluorescent material), or include additional layersto control the optical properties (e.g., the diffusion and consistencyof illuminance) of the LED light wire. Additionally, a mask may beapplied to the outside of the encapsulant to provide different texturesor patterns.

Different design shapes or patterns may also be created at the surfaceof the encapsulant by means of hot embossing, stamping, printing and/orcutting techniques to provide special functions such as lensing,focusing, and/or scattering effects. As shown in FIGS. 15A-C, thepresent invention includes formal or organic shapes or patterns (e.g.,dome, waves, ridges) which influences light rays 1500 to collimate (FIG.15A), focus (FIG. 15B), or scatter/diffuse (FIG. 15C). The surface ofthe encapsulant may be textured or stamped during or following extrusionto create additional lensing. Additionally, the encapsulant 303 may bemade with multiple layers of different refractive index materials inorder to control the degree of diffusion.

Applications of Integrally Formed Single Piece LED Light Wire

The present invention of the integrally formed single piece LED lightwire finds many lighting applications. The following are some examplessuch as light wires with 360° Illumination, full color light wires, andlight wires with individually controlled LEDs. It should be noted thatthese are only some of the possible light wire applications.

The three copper wires 161, 162, 163 delivering electrical power to theLEDs 202 shown in FIG. 16A forming the conductive base may be wound intospirals. The LEDs are connected to the conductors by soldering,ultrasonic welding or resistance welding. Each neighboring LED can beorientated at the same angle or be orientated at different angles. Forexample, one LED is facing the front, the next LED is facing the top,the third LED is facing the back, and the fourth one is facing thebottom etc. Thus, the integrally formed single piece LED light wire canilluminate the whole surrounding in 360°.

An embodiment of the integrally formed single piece LED light wire isshown in FIG. 16B. As shown there are two continuous conductorscorresponding to conductors 161 and 163. Zero ohm jumpers or resistorscouple conductor segments 162 to conductors 161 and 163 to provide powerto LED elements 202. As shown in FIG. 16B, the integrally formed singlepiece LED light wire includes a substrate. In a preferred embodiment,the substrate is flexible. In another embodiment, the single piece lightwire with flexible substrate is wound about a core 9000 (see, forexample, FIG. 11C).

The integrally formed single piece LED light wire is not limited tosingle color. For full color application, the single color LED isreplaced by an LED group consisting of four sub-LEDs in four differentcolors: red, blue, green, and white as shown in FIG. 17. The intensityof each LED group (one pixel) can be controlled by adjusting the voltageapplied across each sub-LED. The intensity of each LED is controlled bya circuit such as the one shown in FIG. 18.

In FIGS. 18, L1, L2, and L3 are the three signal wires for supplyingelectric powers to the four LEDs in each pixel. The color intensity ofeach sub-LED is controlled by a μController 6000 with the timing chartgiven in FIG. 19.

As shown in FIG. 19, because the line voltage L2 is higher than the linevoltage L1 over the first segment of time, the red LED (R) is turned on,whereas, during the same time interval, all the other LEDs are reversebiased and hence they are turned off. Similarly, in the second timeinterval, L2 is higher than L3 thus turning on the green LED (G) andturning off all the other LEDs. The turning on/off of other LEDs insubsequent time segments follows the same reasoning.

New colors such as cold white and orange apart from the four basic onescan be obtained by mixing the appropriate basic colors over a fractionof a unit switching time. This can be achieved by programming amicroprocessor built into the circuit. FIG. 20A and FIG. 20B show thetiming diagrams of color rendering for cold white and orangerespectively. It should be noted that the entire color spectrum can berepresented by varying the timing of signals L1, L2, and L3.

In one embodiment of the invention, each pixel of LEDs can be controlledindependently using a microprocessor circuit into the light wire asshown in FIG. 21. Each LED module 2100 is assigned a unique address.When this address is triggered, that LED module is lit up. It will benoted that each pixel is an LED module consists of a micro-controllerand three (RGB) or four (RGBW) LEDs. The LED modules are seriallyconnected with a signal wire based on daisy chain or star busconfiguration. Alternatively, the LED modules 2100 are arranged inparallel.

There are two ways to assign an address for each LED module. In a firstapproach, a unique address for each pixel is assigned during themanufacturing process. In a second approach, each pixel is assigned anaddress dynamically with its own unique address and each pixel beingcharacterized by its own “address” periodically with trigger signal.Alternatively, the address is assigned dynamically when powered on. Thedynamic addressing has the advantage of easy installation, as theintegrally formed single piece LED light wire can be cut to any length.In one embodiment, the light wire can be cut into any desired lengthwhile it is powered on and functioning.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

1. An integrally-formed light wire, comprising: a first bus elementformed from a conductive material adapted to distribute power from apower source; a second bus element formed from a conductive materialadapted to distribute power from the power source; a third bus elementformed from a conductive material adapted to distribute a controlsignal; a plurality of light emitting diode (LED) modules, each of saidplurality of LED modules comprising a microcontroller and at least oneLED, each LED module being electrically coupled to the first, second,and third bus elements to draw power from the first and second buselements and to receive a control signal from the third bus element; anda continuous unitary encapsulant completely and continuouslyencapsulating said first, second, and third bus elements, and saidplurality of LED modules, including said respective microcontrollers. 2.The integrally-formed light wire of claim 1, wherein the encapsulantfurther comprises light scattering particles.
 3. The integrally-formedlight wire of claim 1, wherein a connection between each of theplurality of LED modules and one of the first and second bus elements isselected from the group consisting of solder, weld, and conductiveepoxy.
 4. The integrally-formed light wire of claim 3, wherein aconnection between each of the plurality of LED modules and another ofthe first and second bus elements is selected from the group consistingof solder, weld, wire bonding, and conductive epoxy.
 5. Theintegrally-formed light wire of claim 1, wherein each of the pluralityof LED modules further comprises a plurality of LEDs, wherein theplurality of LEDs are selected from the group consisting of red, blue,green, and white LEDs.
 6. The integrally-formed light wire of claim 1,wherein each of the plurality of LED modules further comprises a fourthcontact for outputting the received control signal.
 7. Theintegrally-formed light wire of claim 1, wherein each LED module has aunique address used to control the LED module.
 8. The integrally-formedlight wire of claim 7, wherein the address is static.
 9. Theintegrally-formed light wire of claim 7, wherein the address is dynamic.10. The integrally-formed light wire of claim 1, each of the pluralityof LED modules having first, second and third electrical contactsmounted on and electrically coupled to the first, second and third buselements, respectively.